Chemicals for Printed Circuit Boards

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Advanced process chemicals for printed circuit board (PCB) manufacturing, instead of Advanced PCB chemicals providing superior cleaning, conditioning, and activation for reliable printed circuit board manufacturing.

  • PTH chemicals
  • Electroless Copper
  • Pre-treatment and Pattern Plating chemicals
  • Multilayer and Desmear chemicals
  • Tin Stripper, Etchant and Photoresist Developer chemicals
  • Silver- and Gold-Plating chemicals
  • Final Finish chemicals

PTH Chemicals

KEMPLATE CC 150
  • Cleaner conditioner for PCB processing. It increases hole-wall activity, ensuring uniform coverage and effective adsorption of palladium from the Kemplate Activator operating solution. This promotes a uniform, fine-grained, void-free and adherent electroless copper deposit
KEMPLATE AD 1481
  • A mild etchant for through-hole plating of PCB and copper alloys. The operating solution provides clean, uniformly etched copper surfaces using persulphate-based chemistry for controlled etch rate and longer bath life
KEMPLATE E 2743
  • Micro-etch solution based on hydrogen peroxide and sulphuric acid. It provides a controlled etch rate and good stability, preventing decomposition of hydrogen peroxide
KEMPLATE PC-1236 (Pre-dip for Activator Bath)
  • A powdered product used with hydrochloric acid as a pre-dip prior to the Kemplate Activator working solution. The mildly acidic pre-dip removes slight amounts of copper oxide and introduces copper ions into the solution
KEMPLATE ACTIVATOR 1444 / 1446 / 2446
  • Concentrated activator designed for high-chloride, low-acid formulations specifically suited for multilayer PCB applications. This highly concentrated tin–palladium colloidal solution promotes excellent electroless copper coverage with improved adhesion and minimal voids
KEMPLATE PA 1491 (Post Activator)
  • Improves fast initiation of electroless copper deposition and ensures uniform, strong bonding of electroless copper to copper laminate with excellent coverage in plated through-holes

Electroless Copper

KEMPLATE CU 1406
  • A moderate-speed bath that chemically deposits bright, dense and uniform conductive coatings on the walls of through-holes. The fine-grained electroless copper deposit ensures complete coverage of through-hole walls and promotes smooth, void-free copper deposits.
    This highly stable system operates at room temperature and requires flash copper plating prior to photoprinting
KEMPLATE CU 1703
  • An electroless copper plating process designed for printed circuit boards. This highly stable system produces ductile copper deposits with a bright pink colour, allowing easy inspection of through-hole plating. Boards can be processed directly for photoprinting without flash copper plating
KEMPLATE CU 256 (Anti-Tranish for Electroless Copper)
  • A liquid material designed to prevent tarnishing and oxidation of copper surfaces after electroless and electrolytic copper plating. It improves solderability and enhances corrosion protection of copper surfaces

Pre-treatment and Pattern Plating Chemicals

KEMPLATE PC 1455
  • An acidic liquid cleaner used to remove photoresist binder residue from copper surfaces of printed circuit boards prior to pattern plating. It also removes minor soils and handling oils from the copper surface
KEMPLATE AD 1481
  • A mild etchant for through-hole plating of PCB and copper alloys, providing clean and uniformly etched copper surfaces
COPPER PLATING
  • Cupramax HT Process
    A high-throw, bright acid copper plating process that provides stable, bright and ductile copper deposits on conductive printed circuit boards. As a single-additive system, it is easy to control and economical
  • Cupramax HT 296
    A new-generation bright, high-speed acid copper plating process designed for through-hole plating of printed circuit boards. The system is highly stable, easy to operate and employs a single additive
TIN PLATING(Etch Resist) TEKNOLUME BRIGHT ACID TIN PROCESS
  • A bright acid tin plating bath used to provide an effective metallic etch-resist coating that protects the pattern area during subsequent etching processes. It provides excellent solderability and ductility and meets stringent requirements of the electronics industry

Multilayer and Desmear Chemicals

KEMPLATE MB-38 (Black Oxide)
  • A process that produces a uniform black copper oxide coating on copper foils to improve bonding strength between inner layers. It withstands hot air levelling and wave soldering processes while improving solder mask adhesion
KEMPLATE MLB-1495
  • An alkaline dielectric sensitizer and cleaner designed to remove drilling debris from holes and clean dielectric surfaces, creating a clean microporous through-hole topography for multilayer PCBs. Used prior to the permanganate-based etch-back process
      • KEMPLATE MLB-1497
      • Provides controlled attack on organic substrates and removes presensitized dielectric materials from inner layers and hole walls, producing a micro-roughened surface. This improves catalyst absorption for superior electroless copper coverage and adhesion
      KEMPLATE MLB-1498
      • The final stage of the etch-back process that neutralizes manganese compound residues on board surfaces and hole walls, converting them to a soluble state removed by subsequent rinsing. It also removes unwanted copper oxides to promote better copper-to-copper bonding

Tin Stripper, Etchant and Photoresist Developer Chemicals

CIRCASTRIP LT-236 (Tin Stripper)
  • A versatile nitric acid–based stripper designed for rapid stripping of tin and tin-lead alloys from PCBs. It minimizes attack on copper and is suitable for spray or immersion applications
CIRCASTRIP LT-232 (Tin Stripper)
  • A highly stabilized solution used with hydrogen peroxide for stripping solder and tin from copper clad PCBs while minimizing attack on bare copper
KEMPLATE EH 150 (Ammoniacal Etchant)
  • An advanced ammoniacal etching system designed for volume production of printed circuit boards
KEMPLATE PR 195 (Photoresist Developer)
  • A concentrated liquid developer used to prepare aqueous developing solutions for efficient development of photoresist during PCB fabrication

Silver and Gold Plating Chemicals

ARGOASTRA BRIGHT SILVER PROCESS
  • A high-performance bright silver plating bath based on fully organic addition agents that produces bright silver deposits across a wide current density range. Primarily used for electronic and electrical applications
AUROSHINE CC (Gold plating)
  • A hard acid gold plating process using cobalt or nickel as alloying metals to produce bright deposits with good hardness. Suitable for connectors, PCB contacts and switches

Final Finish Chemicals

IMMERSION TIN TEKNOPLATE IM-61(Immersion Tin Process)
  • An immersion tin process designed as a replacement for Hot Air Levelling (HASL). It forms a fine, dense grain structure that remains stable and suppresses the growth of intermetallic layers
ENIG (Electroless Nickel Immersion Gold)
  • Kemplate PC 1455
    An acidic liquid cleaner used to remove photoresist residue and minor contaminants from copper surfaces prior to electroless nickel plating
  • Kemplate AD 1481
    A mild etchant used to prepare copper surfaces prior to electroless nickel plating
  • Kemtek Ni 516 / 508 (Electroless Nickel Process)
    A high-performance electroless nickel process designed for engineering and electronic applications. It produces semi-bright deposits with low and medium phosphorus content
  • Auroshine IMG 3000
    Immersion gold process provides excellent oxidation resistance and a superior soldering surface for PCB manufacturing
Why

Industries Served

Consumer Electronics Automotive Electric Vehicle Batteries Telecommunications Industrial Automation Medical Electronics Aerospace and Defence General Metal Finishing

Sustainability

  • Process chemicals designed to support reliable and efficient PCB manufacturing

  • Optimized surface preparation that helps reduce material waste in PCB production lines

  • Stable electroless copper systems that improve copper utilization

  • High-performance formulations supporting controlled chemical consumption

  • Designed to support RoHS and REACH compliant electronics manufacturing