Chemicals for Printed Circuit Boards

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Advanced PCB chemicals providing superior cleaning, conditioning, and activation for reliable printed circuit board manufacturing.

  • PTH Chemicals
  • Electroless Copper
  • Pre-treatment & Pattern Plating Chemicals
  • Multilayer & Desmear Chemicals
  • Tin Stripper, Etchant & Photoresist Developer Chemicals
  • Silver & Gold Plating Chemicals
  • Final Finish Chemicals

PTH Chemicals

KEMPLATE CC 150
  • Cleaner conditioner for PCB processing. It increases hole-wall activity, ensuring uniform coverage and effective adsorption of palladium from the Kemplate Activator operating solution. This promotes a uniform, fine-grained, void-free and adherent electroless copper deposit
KEMPLATE AD 1481
  • A mild etchant for through-hole plating of PCB and copper alloys. The operating solution provides clean, uniformly etched copper surfaces using persulphate-based chemistry for controlled etch rate and longer bath life
KEMPLATE E 2743
  • Micro-etch solution based on hydrogen peroxide and sulphuric acid. It provides a controlled etch rate and good stability, preventing decomposition of hydrogen peroxide
KEMPLATE PC-1236 (Pre-dip for Activator Bath)
  • A powdered product used with hydrochloric acid as a pre-dip prior to the Kemplate Activator working solution. The mildly acidic pre-dip removes slight amounts of copper oxide and introduces copper ions into the solution
KEMPLATE ACTIVATOR 1444 / 1446 / 2446
  • Concentrated activator designed for high-chloride, low-acid formulations specifically suited for multilayer PCB applications. This highly concentrated tin–palladium colloidal solution promotes excellent electroless copper coverage with improved adhesion and minimal voids
KEMPLATE PA 1491 (Post Activator)
  • Improves fast initiation of electroless copper deposition and ensures uniform, strong bonding of electroless copper to copper laminate with excellent coverage in plated through-holes

Electroless Copper

KEMPLATE CU 1406
  • A moderate-speed bath that chemically deposits bright, dense and uniform conductive coatings on the walls of through-holes. The fine-grained electroless copper deposit ensures complete coverage of through-hole walls and promotes smooth, void-free copper deposits.
    This highly stable system operates at room temperature and requires flash copper plating prior to photoprinting
KEMPLATE CU 1703
  • An electroless copper plating process designed for printed circuit boards. This highly stable system produces ductile copper deposits with a bright pink colour, allowing easy inspection of through-hole plating. Boards can be processed directly for photoprinting without flash copper plating
KEMPLATE CU 256 (Anti-Tranish for Electroless Copper)
  • A liquid material designed to prevent tarnishing and oxidation of copper surfaces after electroless and electrolytic copper plating. It improves solderability and enhances corrosion protection of copper surfaces

Pre-treatment & Pattern Plating Chemicals

KEMPLATE PC 1455
  • An acidic liquid cleaner used to remove photoresist binder residue from copper surfaces of printed circuit boards prior to pattern plating. It also removes minor soils and handling oils from the copper surface
KEMPLATE AD 1481
  • A mild etchant for through-hole plating of PCB and copper alloys, providing clean and uniformly etched copper surfaces
COPPER PLATING
  • Cupramax HT Process
    A high-throw, bright acid copper plating process that provides stable, bright and ductile copper deposits on conductive printed circuit boards. As a single-additive system, it is easy to control and economical
  • Cupramax HT 296
    A new-generation bright, high-speed acid copper plating process designed for through-hole plating of printed circuit boards. The system is highly stable, easy to operate and employs a single additive
TIN PLATING(Etch Resist) TEKNOLUME BRIGHT ACID TIN PROCESS
  • A bright acid tin plating bath used to provide an effective metallic etch-resist coating that protects the pattern area during subsequent etching processes. It provides excellent solderability and ductility and meets stringent requirements of the electronics industry

Antitarnish for Copper & Tin

KEMTEK CU 156
  • Protects copper surfaces prior to solder coating
  • Improves the adhesion of photopolymer film with copper-clad laminate
PASSIVAL 80
  • Protecting tin plated components from deteriorating during storage
  • Netutralizing any residual tin-plating solution after rinsing

PCB Strippers, Etchants & Developers

CIRCASTRIP LT 232
  • Highly stabilized solution used with hydrogen peroxide for stripping of solder and tin from copper-clad PCB
  • Designed to have minimum attack on base copper
CIRCASTRIP LT 236
  • A versatile stripper based on nitric acid for rapid stripping of tin and tin lead alloys from copper clad PCB's
  • Minimum attack on copper
  • Suitable for spray or dip applications
KEMPLATE EH 150
  • EH 150 is an advanced ammonical etching system designed for use in the volume production of printed circuit boards
  • EH 150 offers the PCB manufacturer a fast, safe and economical method of copper etching of printed circuit boards
KEMPLATE PR 195
  • Developer concentrate is a concentrated liquid formulation used to prepare and maintain aqueous developing solutions for efficient development of photoresist during PCB fabrication

Chemicals for Multilayer Processing

KEMPLATE MB 38
  • A unique process which produces uniform black copper oxide coatings on copper foils and thus improves the bond strength between the inner layers and withstands very well during hot air leveling or wave soldering. Also increases the adhesion of solder mask over copper surface
  • Especially suited to multilayer application due to its low acidity
  • Attacks are kept minimum on inner layer coating and has high tolerance for copper
Why

Industries Served

Consumer Electronics Automotive Electric Vehicle Batteries Telecommunications Industrial Automation Medical Electronics Aerospace & Defence

Sustainability

  • Process chemicals support reliable and efficient PCB manufacturing

  • Optimized surface preparation helps reduce material waste in PCB lines

  • Stable electroless copper systems improve copper utilization

  • High-performance formulations support controlled chemical consumption

  • Designed to support RoHS and REACH compliant electronics manufacturing